Share design package
BOM, Gerber or ODB++, pick-and-place, fabrication drawings and revision notes.
PCBA & ELECTRONICS ASSEMBLY
From sourcing to
a board ready for testing.
Explore assembly processes and inspection requirements with JELCORE. Final manufacturing capability, equipment, tolerances and test coverage are confirmed for each project.
PROJECT-LED ASSEMBLY
Your design files set the scope.
Our planning sheet covers 12 possible assembly and test discussion areas, ranging from SMT placement to first-article and shipment documentation.
These are requirements to evaluate when preparing a quote—not unconditional statements about equipment ownership or guaranteed process limits. We will need the actual design and production targets to confirm what is feasible.
PCB and assembly document review Testing scope and acceptance criteria Capacity and lead-time confirmation
PROJECT WORKFLOW
Four conversations before production.
A clearer RFQ helps identify technical and commercial questions early.
Review manufacturing scope
Check assembly quantities, component substitutions, DFM questions and process requirements.
Agree test & acceptance
Define visual inspection, AOI, X-ray, ICT/FCT, programming and acceptance evidence as needed.
Confirm quote & delivery
Align non-recurring engineering, tooling, lead time, packaging and shipment documents.
12 DISCUSSION AREAS
What to specify in your PCBA enquiry.
Expand any topic to see target processes and the questions that need confirmation with the actual manufacturing provider.
Listed figures are examples from a planning workbook. They are not verified JELCORE factory specifications.
Discuss a PCBA project01SMT placement
Scope to discuss: Placement of small passives, QFN/BGA devices and connectors, to be assessed against the PCB design.
Planning target — not a confirmed capability: Target discussion: 01005–0402 packages, 0.35 mm pitch and boards up to 500 × 460 mm.
Important confirmation: Confirm the actual placement-machine model, daily throughput, board dimensions and lead-time impact.
02BGA rework
Scope to discuss: BGA reballing, repair and post-work inspection as required by the project.
Planning target — not a confirmed capability: Example planning target: solder balls 0.3 mm or larger.
Important confirmation: Confirm whether a BGA rework station and X-ray inspection are available in-house or through a partner.
03AOI inspection
Scope to discuss: Automated optical inspection at first-article, sample or wider production stages.
Planning target — not a confirmed capability: Example planning scope: first-article inspection plus full or sample production checks.
Important confirmation: Confirm that inspection programmes and coverage are defined for each customer board and revision.
04X-ray inspection
Scope to discuss: Hidden-joint examination for BGA and QFN devices where required.
Planning target — not a confirmed capability: Planning-sheet target: resolution of 5 μm or finer; not a verified equipment specification.
Important confirmation: Confirm inspection equipment access, whether it is subcontracted and its impact on turnaround.
05ICT / FCT testing
Scope to discuss: In-circuit and functional test preparation, fixture development and acceptance criteria.
Planning target — not a confirmed capability: Test strategy and coverage follow customer specifications.
Important confirmation: Agree fixture ownership, non-recurring engineering cost, test coverage and pass/fail records.
06Conformal coating
Scope to discuss: Selective or whole-board coating with masking and curing steps as needed.
Planning target — not a confirmed capability: Possible materials to review: acrylic, polyurethane and UV-curable coatings.
Important confirmation: Define keep-out regions such as connectors, contacts and gold fingers; confirm suitable process availability.
07Through-hole & soldering
Scope to discuss: Hand insertion and through-hole soldering for terminal blocks, relays and related parts.
Planning target — not a confirmed capability: Wave or selective-wave soldering may be relevant, depending on layout.
Important confirmation: Confirm whether selective soldering is available and review connector-dense board constraints.
08Firmware programming
Scope to discuss: Offline flashing, programmed-device identification and firmware revision tracking.
Planning target — not a confirmed capability: Typical interfaces to plan for: SPI, I²C and UART.
Important confirmation: Agree the approved firmware version, serial-number rules and batch-level programming records.
09Box build & final assembly
Scope to discuss: Mechanical assembly, run-in or ageing, inspection and final packing to customer instructions.
Planning target — not a confirmed capability: Work instructions and conditioning requirements depend on the product.
Important confirmation: Set required run-in duration, records and customer-supplied assembly SOPs.
10Cable harness assembly
Scope to discuss: Cable cutting, terminal crimping, heat-shrink and continuity checks where relevant.
Planning target — not a confirmed capability: Work to customer harness drawings and approved terminal specifications.
Important confirmation: Confirm crimp pull-force testing and the required inspection records.
11First article inspection
Scope to discuss: First-article reports, photographs and dimensional or assembly checks when agreed.
Planning target — not a confirmed capability: A first article may be requested per build or production lot.
Important confirmation: Confirm report format, acceptance signatures and whether records ship with the product.
12Shipment documentation
Scope to discuss: Certificate of conformance, inspection records and lot traceability as contract deliverables.
Planning target — not a confirmed capability: Document scope and format follow the agreed customer template.
Important confirmation: Confirm exactly which batches, part numbers and supporting evidence can be traced and supplied.
RFQ PREPARATION
Files that help us assess your build.
Use the checklist below before sending your enquiry.
BOMManufacturer PNs, quantities, approved alternatives
PCB fabrication filesGerber / ODB++, stack-up, drawings
Assembly dataPick & place, polarity, assembly drawings
Testing requirementsFirmware, fixtures, reports, acceptance criteria
READY TO SOURCE?Send us your BOM.
Send us your BOM.
We'll start with the details.
For specific part numbers, production requirements or PCBA discussions.